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Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/1064
Title: Emission of an edge dislocation from a thin-film-covered crack
Authors: Qian, C.-F.
Zhang, Tong-Yi
Tong, Pin
Keywords: Stress-corrosion cracking
Edge dislocation emission
Fracture
Thin film
Stress intensity factor
Issue Date: 1998
Citation: Fracture and strength of solids : proceedings of the third International Conference on Fracture and Strength of Solids, Hong Kong, 8-10 December 1997, Trans Tech Pub., Uetikon-Zuerich, Switzerland, 1998, Part 1, p. 161-166
Abstract: The emission of an edge dislocation from a thin-film-covered crack is studied in order to investigate the effects of a passive film on stress-corrosion cracking. The results show that the crack stress field in the film due to the applied loads is enhanced by a harder film or abated by a softer film. For an edge dislocation in the film, both the slip component of the image force and the shielding effect are stronger when the film is harder. Under pure mode II or III loadings a harder thin film makes the dislocation emission easier and a softer film makes the dislocation emission more difficult if the film thickness is smaller than a critical value. The opposite is also true if the film thickness is larger than the critical value. Under pure mode I loadings, however, a harder thin film makes the dislocation emission more difficult and a softer film makes the dislocation emission easier for the two film thicknesses used in this study.
Description: The work is supported by the Hong Kong Research Grants Council under RGC Grant, HKUST 819/96E.
URI: http://hdl.handle.net/1783.1/1064
Appears in Collections:MECH Conference Papers

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