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| Title: | Interference issues in silicon RFIC design |
| Authors: | Zhang, Shaofeng
Pun, Alan Leung Ling
Lau, Jack |
| Keywords: | CMOS integrated circuits
Crosstalk
Electromagnetic interference
Electromagnetic shielding
Integrated circuit noise |
| Issue Date: | 1998 |
| Citation: | 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers. IEEE, 1998, p. 119-22 |
| Abstract: | Traditional noise immunity methodologies used in PCB designs are less effective when applied to RFICs. We present here analyses of both electromagnetic interferences and spiral inductor induced substrate noise in silicon RFICs that can be an impediment in achieving higher integration. In the analysis, we (1) compare the effectiveness of 4 shielding solutions in a triple layer metal technology, (2) contrast the interference on both heavily doped and lightly doped substrates, (3) study the impact of physical separation and geometrical variations, (4) and measure the inductor induced substrate noise on a 0.8 um triple-layer CMOS process. |
| Rights: | ©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
| URI: | http://hdl.handle.net/1783.1/1940 |
| Appears in Collections: | ECE Conference Papers
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| zzf_rfic98.pdf | | 85Kb | Adobe PDF | View/Open |
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