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Please use this identifier to cite or link to this item:
http://hdl.handle.net/1783.1/2145
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| Title: | Effect of plasma treatment of Au/Ni/Cu bond pads on process windows of Au wire bonding |
| Authors: | Chan, Yu Hin
Kim, Jang-Kyo
Liu, Deming
Liu, Peter Chou Kee
Cheung, Yiu Ming
Ng, Ming Wai |
| Keywords: | Au wire bond
Au/Ni/Cu bond pad
Process window
Plasma treatment
Surface energy |
| Issue Date: | May-2003 |
| Abstract: | The wire bondability of Au/Ni/Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma cleaned bond pads are exposed to air to evaluate the re-contamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning. |
| URI: | http://hdl.handle.net/1783.1/2145 |
| Appears in Collections: | MECH Technical Reports
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Files in This Item:
| File |
Description |
Size | Format |
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| ChanYHPaper02.pdf | | 156Kb | Adobe PDF | View/Open |
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