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Title: A new system design for the preparation of copper/activated carbon by metalorganic chemical vapor deposition method
Authors: Lam, Frank Leung Yuk
Hu, Xijun
Keywords: MOCVD
Metallic supported activated carbon
Issue Date: 2003
Citation: Chemical engineering science, v. 58, iss. 3-6, Feb-Mar. 2003, p. 687-695
Abstract: A Metal-Organic Chemical Vapor Deposition (MOCVD) technique was used to prepare heterogeneous metallic catalyst supported on activated carbon. A new system design was built to achieve higher metal loading within shorter preparation time. In the optimization of system parameters, higher metal loading can be achieved by using longer deposition time, optimum carrier gas flow rate, higher operating temperature of evaporator or smaller amount of porous support. Several techniques were carried out to characterize the catalyst such as Physisorption, X-Ray Diffraction, Inductively Coupled Plasma - Optical Emission Spectroscopy and Scanning Electronic Microscopy assisted with the Energy Dispersive X-ray Spectroscopy (Sem-EDX). It was found that the B.E.T. specific surface area and total adsorption volume of the prepared catalysts were reduced after metal deposition, due to the formation of the deposited copper onto the porous media. The morphology of the cylindrical Cu/AC was analyzed by SEM-EDX. The results show that the metal was deposited with a resonably uniform distribution onto the inner part of the porous support.
Rights: Chemical Engineering Science © copyright (2003) Elsevier. The Journal's web site is located at
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