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Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/3185
Title: An energy-based failure criterion for delamination initiation in electronic packaging
Authors: Fan, Haibo
Chung, Paular W. K.
Yuen, Matthew Ming-Fai
Chan, Philip Ching-Ho
Keywords: Delamination
Failure criterion
Button shear test
Finite element method
Issue Date: 2005
Citation: Journal of Adhesion Science and Technology, 2005, v. 19, no. 15, p. 1375-1386
Abstract: The significance of interfacial delamination as a crucial failure mechanism in electronic packaging has been documented in many papers. A number of failure criteria have been used to solve the problems with a pre-crack at the interface. However, in real electronic packages, the size and location of the cracks or/and delamination cannot be predicted. It is not easy to use the traditional failture criteria to deal with more complicated 3-D delamination problems. The interface of epoxy molding compound (EMC)/copper leadframe was selected in the study. A series of button shear tests were conducted to evaluate the interfacial adhesion between EMC and copper. In each test, the failure load acting on the EMC of the button shear sample was measured at different shear angles and a finite element model was used to evaluate the stresses at the EMC/copper interface. In this paper, an energy-based failure criterion is proposed by deriving the interfacial strain energy density to the tensile and shear failure modes across the chosen EMC/copper interface. Stresses were extracted from the numerical simulation in order to calculate the distortional interfacial strain energy density, Ud, and the hydrostatic interfacial strain energy density, Uh, related, respectively, to the shear and tensile modes. Ud and Uh were averaged within a selected region of the finite element model where it exhibits high interfacial strain energy density values.
Rights: © Brill, 2005. This is the author's version of the work. It is posted here by permission of Brill for your personal use. Not for redistribution.
URI: http://hdl.handle.net/1783.1/3185
Appears in Collections:MECH Journal/Magazine Articles
ECE Journal/Magazine Articles

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