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Title: Under-bump metallization layers and electroplated solder bumping technology for flip-chip
Other Titles: 微细间距倒装焊凸点电镀制备方法
Authors: Chan, Philip Ching-Ho (陳正豪)
Xiao, Guo Wei (肖國偉)
Keywords: Solder bumps
Manufacturing processes
Issue Date: 20-Dec-2006
Citation: 中國專利 ZL 03140656.4
Abstract: A series of improved processes and methods to manufacture solder bumps on the wafer which shrink the space among solder bumps and reduce the cost of manufacturing. A design method and a relevant manufacturing process are introduced to form an organic material or metal material layer, which is called a Bump-Reflow-Control Layer. The pad patterns can be defined by this method. A mechanical part is designed with a hermetic cover to improve the photoresist process. The series of photolithography process including the designing method of related photolithography mask is introduced to achieve the high quality and thick photoresist.
Rights: This patent is also available at HKUST Technology Transfer Center Patent Search at <>
Appears in Collections:ECE Patents

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