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Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/3363
Title: A method of forming solder bumps for flip chip
Other Titles: 一种用于半导体封装的焊球的制备方法
Authors: Chan, Philip Ching-Ho (陳正豪)
Xiao, Guo Wei (肖國偉)
Keywords: Stencil printing bumping technology
Flip chips
Issue Date: 8-Nov-2006
Citation: 中國專利 ZL 03142416.3
Abstract: A method for the fine-pitch stencil mask design for stencil printing bumping technology for eutectic Sn/Pb and lead-free solder material is described. In the method, a reflowing enhancement layer is introduced to improve the solder quality and reduce the pitch of solder bumps. The method of forming the layer is described as well as the forming method of matching under-bump metallurgy layer. The method of stencil mask design can match various sizes and pitch of the solder bumps. The designed mask is fixed on the stencil printer to deposit the solder materials with the required patterns. This method can increase the solder paste volume to increase the height of solder bumps after the reflowing process.
Rights: This patent is also available at HKUST Technology Transfer Center Patent Search at <http://patentsearch.ttc.ust.hk/ListPatentsDetail.asp?id=208>
URI: http://hdl.handle.net/1783.1/3363
Appears in Collections:ECE Patents

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