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Please use this identifier to cite or link to this item:
http://hdl.handle.net/1783.1/435
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| Title: | Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders |
| Authors: | Lee, Ricky Shi-Wei
Lui, Ben Hoi Wai
Kong, Y. H.
Baylon, Bernard
Leung, Timothy
Umali, Pompeo
Agtarap, Hector |
| Keywords: | Solder joints
Lead-free
Ball grid array
Reliability |
| Issue Date: | 2002 |
| Citation: | Soldering and surface mount technology, v. 14, no. 3, 2002, p. 46-50 |
| Abstract: | Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead-free solder joints for various assembly conditions. A five-leg experiment was designed which included various combinations of solder materials and peak reflow temperatures. It was found that the lead-free solder joints have a much longer thermal fatigue life than the 63Sn-37Pb solder. The 63Sn-37Pb solder joints seem to perform slightly better than the lead-free solder under mechanical loading. |
| URI: | http://hdl.handle.net/1783.1/435 |
| Appears in Collections: | MECH Journal/Magazine Articles
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Files in This Item:
| File |
Description |
Size | Format |
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| p46_s.pdf | | 565Kb | Adobe PDF | View/Open |
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