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Title: Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Authors: Lee, Ricky Shi-Wei
Lui, Ben Hoi Wai
Kong, Y. H.
Baylon, Bernard
Leung, Timothy
Umali, Pompeo
Agtarap, Hector
Keywords: Solder joints
Ball grid array
Issue Date: 2002
Citation: Soldering and surface mount technology, v. 14, no. 3, 2002, p. 46-50
Abstract: Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead-free solder joints for various assembly conditions. A five-leg experiment was designed which included various combinations of solder materials and peak reflow temperatures. It was found that the lead-free solder joints have a much longer thermal fatigue life than the 63Sn-37Pb solder. The 63Sn-37Pb solder joints seem to perform slightly better than the lead-free solder under mechanical loading.
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