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Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/6107
Title: Silicon-on-organic integration of a 2.4–GHz VCO using high-Q copper inductors and solder-bumped flip chip technology
Authors: Huo, Xiao
Xiao, Guo Wei
Chan, Philip Ching-Ho
Chen, Kevin J.
Keywords: CMOS integrated circuits
Copper
Flip chip devices
Inductors
Integrated circuit packaging
Voltage-controlled oscillators (VCOs)
Issue Date: 2009
Citation: IEEE transactions on components and packaging technologies, v. 32, no. 1, March 2009, p. 191-196
Abstract: High-Q copper inductors were fabricated on low-cost and low-loss bismaleimide triazine (BT) and glass substrate using electroplating process. A differential LC voltage-controlled oscillator (VCO) circuit was designed using these high-Q inductors at 2.4 GHz. Flip chip and multichip module (MCM) technologies were applied to assemble the active chips on BT and glass substrate. The inductors exhibited Q-factor as high as 25 at 2.4 GHz. VCOs with copper inductors on BT and glass substrate had phase noise of -108 dBc/Hz at 600 kHz offset for a 2.4-GHz carrier, which is 6-dB improvement compared with the one with on-chip Al inductors. There was almost no substrate loss for inductors on BT and glass substrates. The effect of fabrication defects and solder joint resistance were also investigated. This technique can be extended to other building blocks, thus realizing integration of the whole RF system.
Rights: © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
URI: http://hdl.handle.net/1783.1/6107
Appears in Collections:ECE Journal/Magazine Articles

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