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Title: Silicon-on-organic integration of a 2.4–GHz VCO using high-Q copper inductors and solder-bumped flip chip technology
Authors: Huo, Xiao
Xiao, Guo Wei
Chan, Philip Ching-Ho
Chen, Kevin J.
Keywords: CMOS integrated circuits
Flip chip devices
Integrated circuit packaging
Voltage-controlled oscillators (VCOs)
Issue Date: 2009
Citation: IEEE transactions on components and packaging technologies, v. 32, no. 1, March 2009, p. 191-196
Abstract: High-Q copper inductors were fabricated on low-cost and low-loss bismaleimide triazine (BT) and glass substrate using electroplating process. A differential LC voltage-controlled oscillator (VCO) circuit was designed using these high-Q inductors at 2.4 GHz. Flip chip and multichip module (MCM) technologies were applied to assemble the active chips on BT and glass substrate. The inductors exhibited Q-factor as high as 25 at 2.4 GHz. VCOs with copper inductors on BT and glass substrate had phase noise of -108 dBc/Hz at 600 kHz offset for a 2.4-GHz carrier, which is 6-dB improvement compared with the one with on-chip Al inductors. There was almost no substrate loss for inductors on BT and glass substrates. The effect of fabrication defects and solder joint resistance were also investigated. This technique can be extended to other building blocks, thus realizing integration of the whole RF system.
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