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Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/6155
Title: Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management
Authors: Zhang, Kai
Yuen, Matthew Ming-Fai
Xiao, D. G. W.
Fu, Y. Y.
Chan, Philip Ching-Ho
Keywords: Carbon nanotube
Chemical vapor deposition
Surface treatment
Thermal management (packaging)
Issue Date: 2008
Citation: Proceedings 58th Electronic Components and Technology Conference (ECTC 2008), Lake Buena Vista, FL, U.S.A., 27-30 May 2008, p. 1659-1663
Abstract: Vertically aligned carbon nanotube (VACNT) arrays were synthesized directly on aluminum alloy substrates by thermal chemical vapor deposition (CVD). Iron nitrate (Fe(NO3)3·9H2O) was used as the catalyst. Parameters influencing CNT synthesis were studied and optimized. Several surface treatment methods were proposed to improve the quality of CNTs synthesized on aluminum alloy substrates. The grown CNT arrays were used as thermal interface material (TIM) while the aluminum alloy substrate used as the heat sink in high brightness LED packages. The measured thermal resistance of the grown CNT-TIM was 38 mm2·K/W. The output light power testing demonstrated CNT-TIM is an attractive thermal management solution for HB-LED packages.
Rights: © 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
URI: http://hdl.handle.net/1783.1/6155
Appears in Collections:MECH Conference Papers
ECE Conference Papers

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