HKUST Institutional Repository >
Mechanical Engineering >
MECH Conference Papers >
Please use this identifier to cite or link to this item:
|Title: ||A multiscale approach for investigation of interfacial delamination in electronic packages|
|Authors: ||Fan, Haibo|
Yuen, Matthew Ming-Fai
Molecular dynamics method
|Issue Date: ||2009 |
|Citation: ||Proceedings 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2009), Delft, Netherland, 26-29 April 2009, art. no. 4938514|
|Abstract: ||Interfacial delamination, due to the presence of dissimilar material systems, is one of the primary concerns in electronic package design. Continuum models such as J-integral have been developed to evaluate potential delamination by defining a pre-defined crack at selected interface in the package. The interface is modeled as a discontinuity across the mating material layer. However, at molecular level, the mating materials are held together by a force field which is prescribed by their chemical structures. Molecular dynamics (MD) simulation is an effective tool used to model such force fields. The MD model can be used to simulate the reaction of the interfacial force field under external loading and the result can be utilized to characterize the material properties at the interface. The material properties at the interface are not necessary consistent with those of the bulk materials forming the interface.
The present study is focused on incorporating material behavior at the interface derived from MD simulations into the continuum model. The MD simulations were conducted to construct the constitutive relation of interface under the tensile loading. The constitutive relations from MD simulations in the form of a traction-displacement plot were introduced into the cohesive zone model to study the constitutive response of interface under the mechanical loading, which is traversed across the length scale from nanoscale to macroscale.|
|Rights: ||© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.|
|Appears in Collections:||MECH Conference Papers|
Files in This Item:
All items in this Repository are protected by copyright, with all rights reserved.