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Title: High electromigration-resistant Copper/Carbon nanotube composite for interconnect application
Authors: Chai, Yang
Chan, Philip Ching-Ho
Keywords: Copper/Carbon composite
Interconnect application
Electromigration property
Issue Date: Dec-2008
Citation: Proceedings IEEE International Electron Devices Meeting, 2008. IEDM 2008. San Francisco, CA, USA, 15-17 December 2008, p. 1-4
Abstract: We demonstrated a Cu/CNT composite material for interconnect application. The electromigration (EM) properties of Cu/CNT composite via and line were investigated using Kelvin and Blech test structures respectively. Our results showed that the EM lifetime of the Cu/CNT composite is more than 5 times longer than Cu.
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