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http://hdl.handle.net/1783.1/6625
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| Title: | Flow dependence of interfacial thermal resistance in nanochannels |
| Authors: | liu, Chong
Fan, Haibo
Zhang, Kai
Yuen, Matthew Ming-Fai
Li, Zhigang |
| Keywords: | Adsorption
Argon
Copper
Interface phenomena
Microchannel flow
Silver
Thermal resistance
Two-phase flow |
| Issue Date: | 2-Dec-2009 |
| Citation: | Journal of chemical physics, v. 132, no. 9, March 2010, p. 094703 |
| Abstract: | In nanochannel flows, the thermal resistance at the fluid-solid interface may depend on the flow scenario. In this work, we study the interfacial thermal resistance Rth in nanoscale force-driven flows at different temperatures and fluid-wall interactions. For Ar flows in Cu and Ag channels, the fluid-wall binding energy is strong and it is found that Rth assumes a maximum value as the external force is varied. The maximum value is caused by the fluid adsorption on the solid surfaces and the temperature increase in the fluid due to viscous frictions. However, when the fluid-wall interaction is weak, the maximum value is not observed and the interfacial thermal resistance decreases monotonously with increasing external force. With the presence of fluid adsorption, it is also found that the peak in Rth is more detectable at low temperature than high temperature. |
| Rights: | Copyright (2010) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Journal of Chemical Physics, v. 132, no. 9, March 2010, p. 094703 and may be found at http://link.aip.org/link/JCPSA6/v132/i9/p094703/s1 |
| URI: | http://hdl.handle.net/1783.1/6625 |
| Appears in Collections: | MECH Journal/Magazine Articles
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