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Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/6742
Title: In situ formation of Cu-Sn-Ni intermetallic nanolayer as a diffusion barrier in preplated lead frames
Authors: Fu, Ran
Liu, Lilin
Liu, Deming
Zhang, Tong-Yi
Keywords: Cu alloy
Electroplating
Outdiffusion
Lead frames
Oxidation
Issue Date: 2006
Citation: Applied Physics Letter, vol. 89, iss. 13, Sept. 2006, p. 131911.
Abstract: A technique for impeding Cu outdiffusion in Cu alloy based preplated lead frames has been developed by electroplating a 3-4 nm thick Sn layer on a Cu alloy base prior to electroplating a Ni layer. A 10-14 nm thick epitaxylike and dense (Cu,Ni)3Sn intermetallic-compound (IMC) layer is automatically formed en route of diffuse reaction, which leads to a drastic reduction in Cu outdiffusion and hence improves significantly the protection of the lead frames against oxidation and corrosion attack. The estimated Cu diffusion coefficient in the IMC interlayer is about 1.6 x 10-22m2/s at 250°C.
Rights: Copyright (2006) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.
URI: http://hdl.handle.net/1783.1/6742
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