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Title: Single solder ball impact tester
Authors: Zhang, Zheming
Wu, Jing-Shen
Keywords: Solder ball
Issue Date: 12-Oct-2010
Citation: US Patent 7,810,374 B2, 2010
Abstract: A test apparatus applies high speed impact load to a sample to test the shear strength of attachment of a component part to the sample, by use of a rotary drive mechanism driving an impact tip. A support mechanism provides alignment between the impact tip and a portion of the sample to receive a test force, and prevents relative movement of at least one of the sample and the impact tip. The rotary drive mechanism establishes a impact force between the impact tip and the sample, and a force transducer receives the resultant force and providing a corresponding output. In one example the force transducer uses a piezoelectric film for sensing. The testing may be used, for example, to provide stable impact speed to a solder ball, and provide, as an output a force and displacement relationship curve. The stable speed can be acquired by clutch, and the data collection.
Rights: This patent is also available at HKUST Technology Transfer Center Patent Search at <>
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