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Please use this identifier to cite or link to this item:
http://hdl.handle.net/1783.1/6840
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| Title: | Single solder ball impact tester |
| Authors: | Zhang, Zheming
Wu, Jing-Shen |
| Keywords: | Solder ball
Impact
Shear |
| Issue Date: | 12-Oct-2010 |
| Citation: | US Patent 7,810,374 B2, 2010 |
| Abstract: | A test apparatus applies high speed impact load to a sample to test the shear strength of attachment of a component part to the sample, by use of a rotary drive mechanism driving an impact tip. A support mechanism provides alignment between the impact tip and a portion of the sample to receive a test force, and prevents relative movement of at least one of the sample and the impact tip. The rotary drive mechanism establishes a impact force between the impact tip and the sample, and a force transducer receives the resultant force and providing a corresponding output. In one example the force transducer uses a piezoelectric film for sensing. The testing may be used, for example, to provide stable impact speed to a solder ball, and provide, as an output a force and displacement relationship curve. The stable speed can be acquired by clutch, and the data collection. |
| Rights: | This patent is also available at HKUST Technology Transfer Center Patent Search at <http://patentsearch.ttc.ust.hk/ListPatentsDetail.asp?id=857> |
| URI: | http://hdl.handle.net/1783.1/6840 |
| Appears in Collections: | MECH Patents
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Files in This Item:
| File |
Description |
Size | Format |
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| US7810374.pdf | | 350Kb | Adobe PDF | View/Open |
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