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Items for Author "Baylon, Bernard"

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Date of IssueTitle Authors
2002 Assessment of board level solder joint reliability for PBGA assemblies with lead-free soldersLee, Ricky Shi-Wei; Lui, Ben Hoi Wai; Kong, Y. H.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector