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Items for Author "Fan, Haibo"

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Date of IssueTitle Authors
2005 An energy-based failure criterion for delamination initiation in electronic packagingFan, Haibo; Chung, Paular W. K.; Yuen, Matthew Ming-Fai; Chan, Philip Ching-Ho
2005 Thermal cycling simulation in electronic packages using molecular dynamic methodFan, Haibo; Chan, Edward K. L.; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai
2005 Reliability prediction in electronic packages using molecular simulationFan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai
2005 A new method to predict delamination in electronic packagesFan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai
2005 A multi-scale method for the prediction of delamination in electronic packagesFan, Haibo
2008 A multi-scale interfacial delamination model of Cu-SAM-epoxy systemsFan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai
19-Jun-2008 Interfacial stresses in bi-material system subjected to an exteranl shear forceFan, Haibo; Yuen, Matthew Ming-Fai
2009 A multiscale approach for investigation of interfacial delamination in electronic packagesFan, Haibo; Yuen, Matthew Ming-Fai
May-2009 A multiscale method to predict delamination in Cu-epoxy systems in electronic packagesYuen, Matthew Ming-Fai; Wong, Cell K. Y.; Fan, Haibo
Aug-2009 Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusionFan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai
2-Dec-2009 Flow dependence of interfacial thermal resistance in nanochannelsliu, Chong; Fan, Haibo; Zhang, Kai; Yuen, Matthew Ming-Fai; Li, Zhigang
Apr-2010 Multiscale approach optimization on surface wettability change on rough surfaceYuen, Matthew Ming-Fai; Fan, Haibo; Chan, Edward King-Long
Apr-2010 Molecular design of reliable epoxy-copper interface using molecular dynamic simulationWong, Cell K. Y.; Fan, Haibo; Zhang, G. Q.; Yuen, Matthew Ming-Fai