Showing 13 items.
| Date of Issue | Title |
Authors |
|---|
| 2005 | An energy-based failure criterion for delamination initiation in electronic packaging | Fan, Haibo; Chung, Paular W. K.; Yuen, Matthew Ming-Fai; Chan, Philip Ching-Ho |
| 2-Dec-2009 | Flow dependence of interfacial thermal resistance in nanochannels | liu, Chong; Fan, Haibo; Zhang, Kai; Yuen, Matthew Ming-Fai; Li, Zhigang |
| Aug-2009 | Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusion | Fan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai |
| 19-Jun-2008 | Interfacial stresses in bi-material system subjected to an exteranl shear force | Fan, Haibo; Yuen, Matthew Ming-Fai |
| Apr-2010 | Molecular design of reliable epoxy-copper interface using molecular dynamic simulation | Wong, Cell K. Y.; Fan, Haibo; Zhang, G. Q.; Yuen, Matthew Ming-Fai |
| 2008 | A multi-scale interfacial delamination model of Cu-SAM-epoxy systems | Fan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai |
| 2005 | A multi-scale method for the prediction of delamination in electronic packages | Fan, Haibo |
| 2009 | A multiscale approach for investigation of interfacial delamination in electronic packages | Fan, Haibo; Yuen, Matthew Ming-Fai |
| Apr-2010 | Multiscale approach optimization on surface wettability change on rough surface | Yuen, Matthew Ming-Fai; Fan, Haibo; Chan, Edward King-Long |
| May-2009 | A multiscale method to predict delamination in Cu-epoxy systems in electronic packages | Yuen, Matthew Ming-Fai; Wong, Cell K. Y.; Fan, Haibo |
| 2005 | A new method to predict delamination in electronic packages | Fan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai |
| 2005 | Reliability prediction in electronic packages using molecular simulation | Fan, Haibo; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai |
| 2005 | Thermal cycling simulation in electronic packages using molecular dynamic method | Fan, Haibo; Chan, Edward K. L.; Wong, Cell K. Y.; Yuen, Matthew Ming-Fai |
