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Items for Author "Xiao, Guo Wei"

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Showing 5 items.

Date of Issue	Title	Authors
2001	Reliability study and technology development of solder-bumped flip chip on low-cost substrate	Xiao, Guo Wei
Mar-2006	A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties	Gong, Jing-Feng; Chan, Philip Ching-Ho; Xiao, Guo Wei; Lee, Ricky Shi-Wei; Yuen, Matthew Ming-Fai
14-Nov-2006	Stencil mask design method and under bump metallurgy for C4 solder bump	Xiao, Guo Wei; Chan, Philip Ching-Ho
3-Apr-2007	Under-bump metallization layers and electroplated solder bumping technology for flip-chip	Chan, Philip Ching-Ho; Xiao, Guo Wei
2009	Silicon-on-organic integration of a 2.4–GHz VCO using high-Q copper inductors and solder-bumped flip chip technology	Huo, Xiao; Xiao, Guo Wei; Chan, Philip Ching-Ho; Chen, Kevin J.