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Items for Author "Xiao, Guo Wei"
Showing 5 items.
|Date of Issue||Title
|Mar-2006 ||A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties||Gong, Jing-Feng; Chan, Philip Ching-Ho; Xiao, Guo Wei; Lee, Ricky Shi-Wei; Yuen, Matthew Ming-Fai|
|2001 ||Reliability study and technology development of solder-bumped flip chip on low-cost substrate||Xiao, Guo Wei|
|2009 ||Silicon-on-organic integration of a 2.4–GHz VCO using high-Q copper inductors and solder-bumped flip chip technology||Huo, Xiao; Xiao, Guo Wei; Chan, Philip Ching-Ho; Chen, Kevin J.|
|14-Nov-2006 ||Stencil mask design method and under bump metallurgy for C4 solder bump||Xiao, Guo Wei; Chan, Philip Ching-Ho|
|3-Apr-2007 ||Under-bump metallization layers and electroplated solder bumping technology for flip-chip||Chan, Philip Ching-Ho; Xiao, Guo Wei|