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Items for Author "Xiao, Guo Wei"

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Date of IssueTitle Authors
Mar-2006 A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth propertiesGong, Jing-Feng; Chan, Philip Ching-Ho; Xiao, Guo Wei; Lee, Ricky Shi-Wei; Yuen, Matthew Ming-Fai
2001 Reliability study and technology development of solder-bumped flip chip on low-cost substrateXiao, Guo Wei
2009 Silicon-on-organic integration of a 2.4–GHz VCO using high-Q copper inductors and solder-bumped flip chip technologyHuo, Xiao; Xiao, Guo Wei; Chan, Philip Ching-Ho; Chen, Kevin J.
14-Nov-2006 Stencil mask design method and under bump metallurgy for C4 solder bumpXiao, Guo Wei; Chan, Philip Ching-Ho
3-Apr-2007 Under-bump metallization layers and electroplated solder bumping technology for flip-chipChan, Philip Ching-Ho; Xiao, Guo Wei