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Items for Author "Xiao, Guo Wei (肖國偉)"

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Date of IssueTitle Authors
8-Nov-2006 A method of forming solder bumps for flip chipChan, Philip Ching-Ho (陳正豪); Xiao, Guo Wei (肖國偉)
20-Dec-2006 Under-bump metallization layers and electroplated solder bumping technology for flip-chipChan, Philip Ching-Ho (陳正豪); Xiao, Guo Wei (肖國偉)