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Lee, Ricky S W (李世瑋)

  • Chair Professor, Dept of Mechanical & Aerospace Engineering
  • Associate Dean, Dean's Office (DO), HKUST Fok Ying Tung Graduate School
  • Director, Center for Advanced Microsystems Packaging
  • Director, Foshan Center
  • General Director, Shenzhen Research Institute
  • Professor, Institute for the Environment

Telephone: 2358 7203    Email: rickylee@ust.hk   
Homepage: http://www.me.ust.hk/~rickylee/
Scopus: 8425908400, 7408203713    ORCID: 0000-0002-7706-522X   
Co-authorship graph

Active Projects as Principal Investigator

  • A Deep Reactive Ion Etching System for Nanosystem Fabrication
  • 深港众创智汇社区
  • 大功率小发光面硅基倒装LED光组件的研发和产业化
  • The Fracture Mechanism of PCB Resin Laminate during Pad Cratering and the Board Level Mechanical Reliability Evaluation
  • 基于失效机理的LED 照明系统可靠性与可控寿命技术研究
  • Cost-effective and eco-friendly LED system-on-a-chip (SoC)

Active Projects as Co-investigator

  • Key factor analysis of underfill dispensing process for 3D chip stack package
  • PSKL on advanced displays and optoelectronic technologies