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Lee, Ricky S W (李世瑋)

  • Chair Professor, Dept of Mechanical & Aerospace Engineering
  • Associate Dean, Dean's Office (DO), HKUST Fok Ying Tung Graduate School
  • Director, Center for Advanced Microsystems Packaging
  • Director, Foshan Center
  • General Director, Shenzhen Research Institute
  • Professor, Institute for the Environment

Telephone: 2358 7203    Email: rickylee@ust.hk   
Homepage: http://www.me.ust.hk/~rickylee/
Scopus: 8425908400, 7408203713    ORCID: 0000-0002-7706-522X   
Co-authorship graph

Summary

  Total Conference paper Article Book chapter Book Patent
All publications 336 240 78 8 5 5
HKUST affiliated 331 237 76 8 5 5

Publication List

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Book

Author(s): Lau, J.H. ; Lee, S.W.R. View this author's profile
Source: McGraw-Hill, New York, NY. (ISBN 0-07-038304-9, 564 pages)
Book, 1999

Book chapter

Author(s): Zhang, Xiaodong HKUST affiliated (currently or previously) ; Lee, Ricky Shi Wei View this author's profile ; Le, Fuliang HKUST affiliated (currently or previously)
Source: Materials for Advanced Packaging, Edited by Daniel Lu & C.P. Wong. Switzerland : Springer, 2016, p. 923-951
Book chapter, 2016

Author(s): 李世玮 View this author's profile ; 程玉华 ; 宋复斌 ; Lo, Chi Chuen HKUST affiliated (currently or previously)
Source: 绿色微纳电子学, /王阳元 编. 北京: 科学出版社, 2010, p. 223-306
Book chapter, 2012

Author(s): Lee, Ricky Shi Wei View this author's profile ; Cheng, Y. ; Song, F. ; Lo, Irene M C View this author's profile
Source: Green Micro/Nano Electronics, / Wang, Yangyuan, Cheng, Yuhua, Chi, Minhwa. Berlin: Springer, p. 248-359
Book chapter, 2011

Author(s): Dai, Ruo Li ; Liao, Wei-Hsin ; Lin, Chun-Te ; Chiang, Kuo-Ning ; Lee, Shi-Wei Ricky View this author's profile
Source: Nano-bio-electronic, Photonic and MEMS Packaging, / Edited by C.P. Wong, Kyoung-Sik (Jack) Moon, Yi Li. New York: Springer, c2010, p. 719-758
Book chapter, 2010

Author(s): Zhang, M.S. ; Lee, S.W.R. View this author's profile ; Fan, X.J.
Source: Moisture Sensitivity of Plastic Packages of IC Devices, / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 15, p. 389-409
Book chapter, 2010

Author(s): Lee, Shi-Wei Ricky View this author's profile ; Lo, Chi Chuen HKUST affiliated (currently or previously)
Source: Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Vol. 2, Physical Design--Reliability and Packaging/ Edited by E. Suhir, Y.C. Lee, C.P. Wong. New York: Springer, c2007, chapter 6, p. 151-173
Book chapter, 2007

Author(s): Donahoe, Daniel ; Lee, Shi-Wei Ricky View this author's profile
Source: China's Electronics Industries, / Edited by M.G. Pecht, Y.C. Chan, College Park, Maryland: CALCE EPSC Press, 2004, p.109-136
Book chapter, 2004

Patent

Author(s): Lee, Ricky Shi-Wei View this author's profile ; Li, Hing Leung
Source: US Patent, 5,942,838. Washington, DC: US Patent and Trademark Office, 1999.
Patent, 1999