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Transient temperature performance of an integrated micro-thermal system

Authors Jiang, LN
Wong, M. View this author's profile
Zohar, Y. HKUST affiliated (currently or previously)
Issue Date 2000
Source Journal of micromechanics and microengineering , v. 10, (3), 2000, SEP, p. 466-476
Summary A novel integrated thermal microsystem was designed and fabricated with a heater microchannels and distributed temperature sensors. This device allows, for the first time, an experimental study of the transient behavior of a thermal microsystem. The transient temperature behavior of the device was studied for a variety of heater power levels and forced convection flow rates, where DI water was used as the working fluid. Both hearing-up rise time and cooling-down fall rime due to a step current input were determined for natural and forced convection heat transfer. The transient temperature response to a sinusoidal power input was also investigated. The resulting temperature distribution was measured as a function of the input signal and the how rate. The step response under natural convection is exponential for both heating and cooling processes. However, under forced convection, the heating-up time response exhibits a clear overshoot. The response time for both heating and cooling process is about four times faster than that for the natural convection case. Furthermore, under certain conditions, the periodic temperature: response can exhibit a large peak-peak temperature without the occurrence of dry-out phenomenon.
ISSN 0960-1317
Rights Journal of Micromechanics and Microengineering © Copyright (2000) IOP Publishing Ltd. The Journal's web site is located at
Language English
Format Article
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