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Characterization of Nanostructures Micromachined with Focused Ion Beams (FIB)

Authors Wong, Cheongyui HKUST affiliated (currently or previously).
Xhie, Jie HKUST affiliated (currently or previously).
Moulding, Kieth M. HKUST affiliated (currently or previously).
Issue Date 1999
Source Proceedings of SPIE--the international society for optical engineering , v. 3875, 1999, p. 40-48
Summary Focused Ion Beam (FIB) technology has been demonstrated to be a powerful technique in micro-machining and microfabrication. As the critical dimensions of the device migrate towards the nanometre regime, FIB becomes an important tool in the construction of these devices. In machining and fabrication with FIB in the deep submicron dimensions, an important consideration is the ability to correlate the structures with the processes of deposition or milling so that the instrumental parameters can be optimized. Effects such redeposition during milling in such fine dimensions will have to be controlled. However, since feature size of these structures fabricated with the FIB often have profiles of a few 10's of nanometres, it is increasingly difficult to use standard analytical techniques such as scanning electron microscopy (SEM) to resolve such features. At the same time, atomic force microscopy (AFM) with it's near atomic resolution is now a standard metrology tool in semiconductor manufacturing. In this paper the authors would like to demonstrate, using Atomic force Microscopy (AFM), the effects of parameters such as probe current on the micromachined profiles produced by FIB. We will compare these results obtained with AFM with those using SEM. Control of these parameters in the fabrication of nanostructures on different substrate materials such as metals and semiconductors will also be demonstrated.
Note Proceedings of the 1999 Materials and Device Characterization in Micromachinig II; Santa Clara, CA, USA; 20-21 September 1999; Code 56137
ISSN 0277-786X
ISBN 0819434728
Rights Copyright 1999 Society of Photo-Optical Instrumentation Engineers. This paper was published in Materials and Device Characterization in Micromachining II, Yuli Vladimirsky, Craig R. Friedrich, Editors, Proceedings of SPIE Vol. 3875, p. 40-43 (1999) and is made available as an electronic reprint with permission of SPIE. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Language English
Format Conference paper
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