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Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Authors Yan, Eric C.C.
Lee, Shi Wei Ricky View this author's profile
Huang, Xingjia
Issue Date 2004
Source Soldering & Surface Mount Technology , v. 16, (2), 2004, p. 21-26
Summary This paper presents an experimental study to assess the reliability of solder ball attachment to the bond pads of PBGA substrate for various plating schemes. The basic structure of the under bump metallisation is Cu/Ni/Au. Three different kinds of electroless plating solutions are used to deposit the Ni layer, namely, Ni-B, Ni-P (5 per cent), and Ni-P (10 per cent). Also, conventional electrolytic Ni/Au plating is performed to provide a benchmark. After solder ball attachment, mechanical tests are conducted to characterize the ball shear strength for comparison. Furthermore, some specimens are subjected to multiple reflows to investigate the thermal aging effect.
ISSN 0954-0911
Language English
Format Article
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