Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/3362

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Authors Chan, Philip Ching-Ho (陳正豪)
Xiao, Guo Wei (肖國偉)
Issue Date 2006-12-20
Source 中國專利 , ZL 03140656.4
Summary A series of improved processes and methods to manufacture solder bumps on the wafer which shrink the space among solder bumps and reduce the cost of manufacturing. A design method and a relevant manufacturing process are introduced to form an organic material or metal material layer, which is called a Bump-Reflow-Control Layer. The pad patterns can be defined by this method. A mechanical part is designed with a hermetic cover to improve the photoresist process. The series of photolithography process including the designing method of related photolithography mask is introduced to achieve the high quality and thick photoresist.
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Rights This patent is also available at HKUST Technology Transfer Center Patent Search at <http://patentsearch.ttc.ust.hk/ListPatentsDetail.asp?id=207>
Language English
Format Patent
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