Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/39184

3D IC Integration with TSV Interposers for High Performance Applications

Authors Lau, J.H.
Chan, Y.S.
Lee, S.W.R. View this author's profile
Issue Date 2010
Source Chip scale review , v. 14, (5), 2010, p. 26-29
ISSN 1526-1344
Language English
Format Article
Access Find@HKUST