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3D LED and IC wafer level packaging

Authors Lau, John
Lee, Ricky View this author's profile
Yuen, Matthew View this author's profile
Chan, Philip HKUST affiliated (currently or previously)
Issue Date 2010
Source Microelectronics International , v. 27, (2), 2010, p. 98-105
Summary Purpose - The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach - These packages consist of the multi-LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed. Findings - The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor. Originality/value - A thermal management system for 3D IC and LEDs integration packages is proposed.
ISSN 1356-5362
Language English
Format Article
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