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Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Authors Lee, SWR
Lui, BHW
Kong, YH
Baylon, B
Leung, T
Umali, P
Agtarap, H
Issue Date 2002
Source Soldering & Surface Mount Technology , v. 14, (3), 2002, p. 46-50
Summary Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead-free solder joints for various assembly conditions. A five-leg experiment was designed which included various combinations of solder materials and peak reflow temperatures. It was found that the lead-free solder joints have a much longer thermal fatigue life than the 63Sn-37Pb solder. The 63Sn-37Pb solder joints seem to perform slightly better than the lead-free solder under mechanical loading.
ISSN 0954-0911
Language English
Format Article
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