Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/52510

Reliability of high-power LED packaging and assembly

Authors Liu, Cheng-Yi
Lee, S. W. Ricky View this author's profile
Shin, Moo Whan
Lai, Yi-Shao
Issue Date 2012
Source Microelectronics Reliability , v. 52, May 2012, p. 761
ISSN 0026-2714
Language English
Format Article
Access View full-text via DOI
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