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LED wafer level packaging with a remote phosphor cap

Authors Liu, Huihua
Zhang, Rong
Lo, Chi Chuen HKUST affiliated (currently or previously)
Lee, Shi-Wei Ricky View this author's profile
Issue Date 2012
Source 14th International Conference on Electronic Materials and Packaging, EMAP 2012 , 2012, session P068, article number 6507885
Summary Phosphor converted LEDs (pc-LEDs), which employ yellow phosphor deposited on blue LEDs to generate white light illumination have been widely used in solid-state lighting (SSL). Currently most LEDs are packaged on an individual component basis. Such a conventional packaging process typically may have a relatively low throughput and poor uniformity. In this paper, a new structure for 3D wafer level LED packaging is introduced. The package consists of three parts: a silicon submount wafer with pre-mounted LEDs, a silicon cap wafer, and a layer of phosphor film. Each part was independently fabricated and subsequently assembled at the wafer level. The optical performance of singulated prototypes was characterized using an integrating sphere. Comparison and discussion of samples with various phosphor-silicone mixing ratios are given in detail. © 2012 IEEE.
ISSN 2151-7231
ISBN 9781467349444
Language English
Format Conference paper
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