Please use this identifier to cite or link to this item:

Emerging trend for LED wafer level packaging

Authors Lee, Ricky Shi-wei View this author's profile
Zhang, Rong HKUST affiliated (currently or previously)
Chen, Kevinjing HKUST affiliated (currently or previously).
Lo, Chi Chuen HKUST affiliated (currently or previously)
Issue Date 2012
Source Frontiers of Optoelectronics , v. 5, (2), June 2012, p. 119-126
Summary Currently most light emitting diode (LED) components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging (WLP). Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLP. © 2012 Higher Education Press and Springer-Verlag Berlin Heidelberg.
ISSN 2095-2759
Language English
Format Article
Access View full-text via DOI
View full-text via Scopus