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Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints

Authors Yang, Chaoran HKUST affiliated (currently or previously)
Song, Fubin
Lee, Ricky Shi-wei View this author's profile
Issue Date 2014
Source Microelectronics Reliability , v. 54, (2), February 2014, p. 435-446
Summary Cu6Sn5 and Cu3Sn are common intermetallic compounds (IMCs) found in Sn-Ag-Cu (SAC) lead-free solder joints with OSP pad finish. People typically attributed the brittle failure to excessive growth of IMCs at the interface between the solder joint and the copper pad. However, the respective role of Cu6Sn5 and Cu3Sn played in the interfacial fracture still remains unclear. In the present study, various amounts of Ni were doped in the Sn-Cu based solder. The different effects of Ni concentration on the growth rate of (Cu, Ni)(6)Sn-5/Cu6Sn5 and Cu3Sn were characterized and compared. The results of characterization were used to evaluate different growth rates of (Cu, Ni)(6)Sn-5 and Cu3Sn under thermal aging. The thicknesses of (Cu, Ni)(6)Sn-5/Cu6Sn5 and Cu3Sn after different thermal aging periods were measured. High speed ball pull/shear tests were also performed. The correlation between interfacial fracture strength and IMC layer thicknesses was established. (C) 2013 Elsevier Ltd. All rights reserved.
ISSN 0026-2714
Language English
Format Article
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