Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/6107

Silicon-on-Organic Integration of a 2.4-GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology

Authors Huo, Xiao
Xiao, Guo-Wei
Chan, Philip C. H.
Chen, Kevin J.
Issue Date 2009
Source IEEE transactions on components and packaging technologies, v. 32, (1), 2009, MAR, p. 191-196
Summary High-Q copper inductors were fabricated on low-cost and low-loss bismaleimide triazine (BT) and glass substrate using electroplating process. A differential LC voltage-controlled oscillator (VCO) circuit was designed using these high-Q inductors at 2.4 GHz. Flip chip and multichip module (MCM) technologies were applied to assemble the active chips on BT and glass substrate. The inductors exhibited Q-factor as high as 25 at 2.4 GHz. VCOs with copper inductors on BT and glass substrate had phase noise of - 108 dBc/Hz at 600 kHz offset for a 2.4-GHz carrier, which is 6-dB improvement compared with the one with on-chip Al inductors. There was almost no substrate loss for inductors on BT and glass substrates. The effect of fabrication defects and solder joint resistance were also investigated. This technique can be extended to other building blocks, thus realizing integration of the whole RF system.
Subjects
ISSN 1521-3331
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Language English
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