Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/6585

High Electromigration-Resistant Copper/Carbon Nanotube Composite for Interconnect Application

Authors Chai, Yang
Chan, Philip C. H.
Issue Date 2008
Source IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST , 2008, p. 607-610
Summary We demonstrated a Cu/CNT composite material for interconnect application. The electromigration (EM) properties of Cu/CNT composite via and line were investigated using Kelvin and Blech test structures respectively. Our results showed that the EM lifetime of the Cu/CNT composite is more than 5 times longer than Cu.
Subjects
ISSN 0163-1918
ISBN 978-1-4244-2377-4
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Language English
Format Conference paper
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