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Flow dependence of interfacial thermal resistance in nanochannels

Authors Liu, Chong HKUST affiliated (currently or previously)
Fan, HaiBo HKUST affiliated (currently or previously)
Zhang, Kai HKUST affiliated (currently or previously)
Yuen,Matthew Ming Fai View this author's profile
Li, Zhigang View this author's profile
Issue Date 2010
Source Journal of chemical physics , v. 132, (9), 2010, MAR 7
Summary In nanochannel flows, the thermal resistance at the fluid-solid interface may depend on the flow scenario. In this work, we study the interfacial thermal resistance R-th in nanoscale force-driven flows at different temperatures and fluid-wall interactions. For Ar flows in Cu and Ag channels, the fluid-wall binding energy is strong and it is found that R-th assumes a maximum value as the external force is varied. The maximum value is caused by the fluid adsorption on the solid surfaces and the temperature increase in the fluid due to viscous frictions. However, when the fluid-wall interaction is weak, the maximum value is not observed and the interfacial thermal resistance decreases monotonously with increasing external force. With the presence of fluid adsorption, it is also found that the peak in R-th is more detectable at low temperature than high temperature.
ISSN 0021-9606
Rights Copyright (2010) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Journal of Chemical Physics, v. 132, no. 9, March 2010, p. 094703 and may be found at
Language English
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