Please use this identifier to cite or link to this item: http://hdl.handle.net/1783.1/6742

In situ formation of Cu-Sn-Ni intermetallic nanolayer as a diffusion barrier in preplated lead frames

Authors Fu, Ran
Liu, Lilin
Liu, Deming
Zhang, Tong-Yi
Issue Date 2006
Source Applied physics letters , v. 89, (13), 2006, SEP 25, article number 131911
Summary A technique for impeding Cu outdiffusion in Cu alloy based preplated lead frames has been developed by electroplating a 3-4 nm thick Sn layer on a Cu alloy base prior to electroplating a Ni layer. A 10-14 nm thick epitaxylike and dense (Cu,Ni)(3)Sn intermetallic-compound (IMC) layer is automatically formed en route of diffuse reaction, which leads to a drastic reduction in Cu outdiffusion and hence improves significantly the protection of the lead frames against oxidation and corrosion attack. The estimated Cu diffusion coefficient in the IMC interlayer is about 1.6x10(-22) m(2)/s at 250 degrees C. (c) 2006 American Institute of Physics.
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ISSN 0003-6951
Rights Copyright (2006) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.
Language English
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