Please use this identifier to cite or link to this item:

Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusion

Authors Fan, H.B. HKUST affiliated (currently or previously)
Wong, C.K.Y. HKUST affiliated (currently or previously)
Yuen, M.M.F. View this author's profile
Issue Date 2009
Source 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 , 2009, p. 234-237
Summary Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning during the solder reflow of plastic-encapsulated IC packages is a frequently occurred defect due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of plastic packages. To improve package reliability and to prevent interfacial delamination, it is important to design the EMC/Cu interface for high hydrophobicity and good adhesion. The object of this paper is an investigation of both adhesion and moisture absorption at the EMC/Cu interface using MD simulations. Three kinds of models containing SAM1, SAM2 and a mixture of SAM1 and SAM2, have been used to evaluate the bonding energy and moisture absorption between EMC and SAM coated Cu substrate in this study. In each model, SAM1 or SAM2 or mixture of SAM1 and SAM2 chains were aligned on the copper substrate. MD simulations were performed at a given temperature using the constant-volume and temperature ensemble (NVT). Non-bond interactions cut-off distance of 1.25 nm with a smooth switching function was used in all simulations. The simulations were performed with an interval of 1 femto second (fs) in each MD simulation step. Moisture distribution and binding energy were calculated from simulation for each model. MD simulation results showed that the SAM1 has the higher bonding energy, while SAM2 has the higher hydrophobicity. It was also found that a mixture of SAM1 and SAM2 has both a higher bonding energy and a higher hydrophobicity which can be used as an interface promoter for adhesion and moisture inhibitor in electronic packages. This study shows that MD simulation can be an efficient tool for optimization of SAM to create a hydrophobic interface, which can provide useful pointers of the selection of the SAM structure. ©2009 IEEE.
Rights © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Language English
Format Conference paper
Access View full-text via DOI
View full-text via Scopus
Files in this item:
File Description Size Format
05270758.pdf 824316 B Adobe PDF