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Single solder ball impact tester

Authors Zhang, Zheming HKUST affiliated (currently or previously)
Wu, Jingshen View this author's profile
Issue Date 2010-10-12
Source US Patent , 7,810,374 B2, 2010
Summary A test apparatus applies high speed impact load to a sample to test the shear strength of attachment of a component part to the sample, by use of a rotary drive mechanism driving an impact tip. A support mechanism provides alignment between the impact tip and a portion of the sample to receive a test force, and prevents relative movement of at least one of the sample and the impact tip. The rotary drive mechanism establishes a impact force between the impact tip and the sample, and a force transducer receives the resultant force and providing a corresponding output. In one example the force transducer uses a piezoelectric film for sensing. The testing may be used, for example, to provide stable impact speed to a solder ball, and provide, as an output a force and displacement relationship curve. The stable speed can be acquired by clutch, and the data collection.
Language English
Format Patent
Access View details of TTC.PA.361 via HKUST Technology Transfer Center
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