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Wax-bonding 3D microfluidic chips

Authors Gong, Xiuqing
Yi, Xin
Xiao, Kang
Li, Shunbo HKUST affiliated (currently or previously)
Kodzius, Rimantas
Qin, Jianhua
Wen, Weijia View this author's profile
Issue Date 2010
Source Lab on a chip , v. 10, (19), 2010, p. 2622-2627
Summary We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes. The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
ISSN 1473-0197
Rights Lab on a Chip © Royal Society of Chemistry 2010. The final published article is available at
Language English
Format Article
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