Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints
Lee, Ricky S.W.
|Source||Microelectronics Reliability , v. 62, July 2016, p. 130-140|
|Summary||A detailed experimental study on the fracture mechanism of Cu-Sn intermetallic compounds (IMCs) in the Pb-free solder was presented in this paper. The growth behaviors of the Cu6Sn5 and Cu3Sn IMCs were inspected and the respective evolution pattern of their microstructures was investigated. Then, a detailed fractographic analysis on brittle fractured solder joints was conducted after the high speed ball pull test. The fracture locations in the Cu-Sn IMC layers during different periods of aging process were identified. The fracture modes of Cu6Sn5 and Cu3Sn were determined as well. Afterwards, the fracture energies of different Cu-Sn IMC materials were directly compared using the Charpy impact test with a specially designed specimen. It was found that the grain boundary of Cu3Sn is the weakest link in the Cu-Sn IMC system. Finally, based on these three parts of study, a mechanism to explain the thermal degradation of Cu-Sn IMCs was proposed. © 2016 Elsevier Ltd.|
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